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8-14 May 2014, Dusseldorf
Hall 11, Stand F03

INVITATION

We are happy to invite you to our Stand F03 at Hall 11, at the biggest international packaging exhibition Interpack 2014.

At our booth, we will present the MEL System, an international breakthrough in the design and implementation of end-of-line packaging systems. The MEL System (Modular End of Line) is designed entirely by Zenon’s skilled engineers. It has been successfully implemented at a number of multinational manufacturing companies, delivering dramatic increase in productivity, OEE and optimal utilization of existing infrastructure. More information can be found at the Zenon web site: www.zenon.gr

More information about Interpack International Packaging Exhibition

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